Product Data Sheet Safety Data Sheet Show all documents
Nailbond® SB Original

Nailbond® SB Original

Solvent based gap filling stud and wallboard adhesive

Nailbond® SB Original is a flexible, extreme strength, no drip, no slump, easy to use gap filling heavy duty construction adhesive.

  • Extremely strong bond
  • Non‐slump and non‐drip, even in overhead situations
  • Interior or exterior
  • Suitable for LOSP and CAA treated timbers
  • Gap filling
  • Very good initial tack
  • Still flexible when cured, will accommodate normal movement
  • Suitable for most wallboard types – see limitations
  • Guns easily in cold temperatures
Product Data Sheet Safety Data Sheet Show all documents

Usage

It is designed for bonding a wide range of wallboards, panels and flooring to timber or metal studs, framing or joists. It is also suitable for bonding timber, particle board flooring, plywood, tiles, architraves, mouldings, metal or aluminium door/step strips, and many other common building materials.  

Advantages

  • Extremely strong bond
  • Non‐slump and non‐drip, even in overhead situations
  • Interior or exterior
  • Suitable for LOSP and CAA treated timbers
  • Gap filling
  • Very good initial tack
  • Still flexible when cured, will accommodate normal movement
  • Suitable for most wallboard types – see limitations
  • Guns easily in cold temperatures

Packaging

375 ml standard cartridge, carton of 8 (Trade Pack) or 20 cartridges

Colour

Beige

Product Details

Sustainability / Certifications / Approvals

APPROVALS / STANDARDS

NZ Building Code Compliant

  • B1 Structure. When used as a component of compliant building element systems
  • B2 Durability: Clauses B2.3.1 (b) 15 years. (c) 5 years
  • F2 Hazardous Building Materials: Clause F2.3.1
Product Information

Chemical Base

Non‐slumping solvent based adhesive

Shelf Life

Eighteen (18) months from date of production when stored as stated.

Storage Conditions

Store properly in original unopened, sealed and undamaged packaging in cool and dry conditions at temperatures between +5°C and +30°C. Protect from direct sunlight.

Solid content by weight

~ 65%
Technical Information

Movement Capability

Slight, will accept normal building movement

Service Temperature

Up to +70°C

Application

Application Information

Ambient Air Temperature

Application temperature: +5°C to +50°C

Curing Time

90% of strength is gained between 8‐24 hours. Full cure is achieved in 7 days (at 20°C).
Consumption

Yield

Gun application: On average one 375 ml cartridge will supply 20 metres of 5 mm bead.
Application steps

SUBSTRATE PREPARATION

All surfaces must be clean, dry, and free from all dust, laitance, scale, rust, loose particles, grease and foreign matter. Nailbond® SB Original will bond to damp timber but note that damp timber will shrink and this will put stress on the bond. It is always best practice to use dry timber.

CLEANING OF TOOLS

Clean up using Sika® Thinner C.

Documents